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Dayoo Advanced Ceramic Co.,Ltd
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> 상품 > 탄화규소계 세라믹스 > Diamond-Shaped Hollow Silicon Carbide Ceramic Wafer Carrier with High Thermal Conductivity and 1400℃ High-temperature Resistance for Semiconductor Applications

Diamond-Shaped Hollow Silicon Carbide Ceramic Wafer Carrier with High Thermal Conductivity and 1400℃ High-temperature Resistance for Semiconductor Applications

제품 세부 정보

원래 장소: 중국

브랜드 이름: Dayoo

지불 및 배송 조건

최소 주문 수량: 맞춤형

가격: CNY

포장 세부 사항: 패키지

배달 시간: 60 근무일

공급 능력: 공장

가장 좋은 가격 을 구하라
강조하다:
높은 열전도율:
열충격 저항:
좋은
최대 온도:
1380 ℃
굽힘 강도:
280 Mpa
청정:
98%
압축강도:
> 2GPa
높은 열전도율:
열충격 저항:
좋은
최대 온도:
1380 ℃
굽힘 강도:
280 Mpa
청정:
98%
압축강도:
> 2GPa
Diamond-Shaped Hollow Silicon Carbide Ceramic Wafer Carrier with High Thermal Conductivity and 1400℃ High-temperature Resistance for Semiconductor Applications
Diamond-shaped Hollow Silicon Carbide Ceramic Wafer Carrier | Precision Hollow SiC Ceramic Support Plate Product Introduction This product is a Diamond-shaped Hollow Silicon Carbide Ceramic Wafer Carrier, manufactured from high-purity silicon carbide (SiC) ceramic raw materials. It features an overall diamond outline with multi-layer annular radial hollow structure in the center. Fabricated via atmospheric pressure high-temperature sintering and precision machining, it boasts